30% lighter than conventional ready mix Approximately 30% lighter than conventional ProForm Joint Compound. Up to 33% less shrinkage than conventional joint compound. Mold Resistant. ProForm® Lite with Dust-Tech® is a vinyl base ready mix lightweight joint compound. Approximately 30% lighter than conventional ready mix, it pulls and sands easier and reduces shrinkage by up to 33%. ProForm® Lite with Dust-Tech® is designed for use in finishing gypsum board joints, spotting fasteners, and finishing corner bead. Advantages Lightweight. Approximately 30% lighter than conventional ProForm Joint Compound. Reduced shrinkage. Up to 33% less shrinkage than conventional joint compound. Superior finish. Provides a finish with less pocking and pin holing. Easier pull. Spreads easier for quick application. Finishes metal beads with two coats. Excellent sanding characteristics. Ready to use right from the container. Mold resistant. Low VOC content - less than 2 grams/liter. Color: Gray Compositions: Calcium Carbonate or Calcium/Magnesium Carbonate Limestone or Dolomite Ethylene Vinyl Acetate Latex Hydrated Magnesium Silicate Talc Non-Asbestiform Magnesium Aluminum Phyllosilicate Attapulgite Clay Magnesium Aluminum Phyllosilicate Smectite Clay Magnesium Silicate Sepiolite Clay Mixture-Silicates Aluminates Mica Mixture-Various Metal Oxides Perlite Polyvinyl Acetate Latex Vinyl Acetate/Acrylic Co-Polymer Drying Time: 24 hr Form: Paste Net Content: 1 gal Odor/ Scent: Mild Latex Package Size: 1 gal Package Type: Pail p H Range: 7 to 9 Specific Gravity: 1 to 1.8 Temperature Rating: 50 deg F V O C Content: 2 g/L Features Reduces airborne dust by 60% and ensures quick as well as easy clean-up Resists the growth of mold Reduced shrinkage Up to 33% less shrinkage than conventional joint compound Easier pull Spreads easier for quick application Sands without clogging sandpaper Ready to use right from container after mixing